Fiscal Year	2007
Division	Graduate School of Engineering & Applied Science
Department	Mechanical & Aerospace Engineering
Investigator(s)	Dutta, Indranath
Sponsor	National Science Foundation (NSF)
Summary	In this work, we propose a comprehensive experimental plan to generate fundamental mechanistic insight into the role of several microstructural and test variables on the fracture of solder joints under rapid loading conditions. The outcome of this study will be the ability to design microelectronic solder joints with greater fracture toughness under drop conditions via better control of processing, microstructural and geometrical parameters. An additional outcome will be the transfer of experimental approaches developed through this work to the industry.
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Publications	Publications, theses (not shown) and data repositories will be added to the portal record when information is available in FAIRS and brought back to the portal
Data	Publications, theses (not shown) and data repositories will be added to the portal record when information is available in FAIRS and brought back to the portal