Fiscal Year	2007
Division	Graduate School of Engineering & Applied Science
Department	Mechanical & Aerospace Engineering
Investigator(s)	Dutta, Indranath
Sponsor	Purdue University (Other)
Summary	The objective of this work is aimed at developing experimentally validated constitutive models for deformation and failure of solder joints under high strain rate, creep and electromigration conditions.
Keywords
Publications	Publications, theses (not shown) and data repositories will be added to the portal record when information is available in FAIRS and brought back to the portal
Data	Publications, theses (not shown) and data repositories will be added to the portal record when information is available in FAIRS and brought back to the portal